Simulation of photoacoustic imaging of microcracks in silicon wafers using a structure-changeable multilayered thermal diffusion model.

@article{Nakata2007SimulationOP,
  title={Simulation of photoacoustic imaging of microcracks in silicon wafers using a structure-changeable multilayered thermal diffusion model.},
  author={Toshihiko Nakata and Takehiko Kitamori and Tsuguo Sawada},
  journal={Applied optics},
  year={2007},
  volume={46 7},
  pages={1019-25}
}
The detection characteristics for photoacoustic imaging of microcracks in silicon wafers were theoretically and quantitatively investigated using a numerical simulation. The simulation is based on a one-dimensional multilayered thermal diffusion model coupled with the thermal-wave impedance of each layer, the layer structures of which are constructed along… CONTINUE READING