Simulation of encapsulation stress in a micromachined silicon membrane pump

Abstract

The encapsulation stress induced on a micromachined silicon membrane pump encapsulated in plastic is quantified. A combination of numerical and analytical techniques are used to deduce limits for the maximum permissible diemensions of a membrane subject to encapsulation stresses. The approach uses finite element techniques to estimate the membrane stress… (More)

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@inproceedings{Kelly2004SimulationOE, title={Simulation of encapsulation stress in a micromachined silicon membrane pump}, author={Gregg Kelly and Jolyon Alderman and Colin Lyden and J. Barrett}, year={2004} }