Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime

@article{Nguyen2002SimulationAE,
  title={Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime},
  author={H. V. Nguyen and Cora Salm and R. Wenzel and A. J. Mouthaan and Fred G. Kuper},
  journal={Microelectronics Reliability},
  year={2002},
  volume={42},
  pages={1421-1425}
}