Silver sinter paste for SiC bonding with improved mechanical properties

@article{Schmitt2017SilverSP,
  title={Silver sinter paste for SiC bonding with improved mechanical properties},
  author={Wolfgang Schmitt and Ly May Chew and Daniel Schnee},
  journal={2017 IEEE 67th Electronic Components and Technology Conference (ECTC)},
  year={2017},
  pages={1560-1565}
}
Silver sintering become a common technology for high reliability or high temperature electronic devices. Different sintering processes are applied depending upon application requirements, for instance pressure sintering process is optimized for elevated life time power modules. The pressure of the sintering process can be adjusted in order to modify the properties of the sinter layer. In general, higher pressure or temperature leads to higher Young's modulus. With respect to the lifetime of an… CONTINUE READING

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