Silver-based thermal interface materials with low thermal resistance

Abstract

We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the… (More)

6 Figures and Tables

Topics

  • Presentations referencing similar topics