Silicon interposer with embedded microfluidic cooling for high-performance computing systems

@article{Zheng2015SiliconIW,
  title={Silicon interposer with embedded microfluidic cooling for high-performance computing systems},
  author={Li Zheng and Yang Zhang and Xuchen Zhang and Muhannad S. Bakir},
  journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
  year={2015},
  pages={828-832}
}
A silicon interposer platform utilizing microfluidic cooling is proposed to address the off-chip signaling and cooling challenges facing future high-performance computing systems. A test vehicle with microfluidic I/Os and a micropin-fin heat sink was used to evaluate microfluidic cooling performance. De-ionized water (~20 °C) was used as the coolant. At a flow rate of 50 mL/min, the measured temperature was 55.9 °C for a power density of 97.0 W/cm2. Compared to air cooling, microfluidic cooling… CONTINUE READING

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