Silicon MCM-D technology for RF integration

@article{Arnold1997SiliconMT,
  title={Silicon MCM-D technology for RF integration},
  author={Ronald G. Arnold and Colm C. Faulkner and David John Pedder},
  journal={Proceedings 1997 International Conference on Multichip Modules},
  year={1997},
  pages={340-344}
}
The thin film implementation of Multichip Module technology has been identified as a useful platform for the integration of GaAs MMICs and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performances in the microwave frequency regime has now been demonstrated. This paper describes the 3… CONTINUE READING

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