Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools

@article{Murray2007SiliconBS,
  title={Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools},
  author={Fergal Murray and F. LeCornec and S. Bardy and C. Bunel and J.F.C. Verhoeven and F.C.M. van den Heuvel and J. Klootwijk and Fred Roozeboom},
  journal={2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems},
  year={2007},
  pages={149-153}
}
The very large development of home and domestic electronic appliances as well as portable device has led the microelectronics industry to evolve in two complimentary directions: "More Moore" with the continuous race towards extremely small dimensions hence the development of SoCs (system on chip) and more recently a new direction that we could name "More than Moore" with the integration of devices that were laying outside the chips and thus the creation of SiPs (system in package). The… CONTINUE READING

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