SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temperature operation. A thermal cycling test with large… CONTINUE READING

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