SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

@article{Ning2009SiCWM,
  title={SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment},
  author={Puqi Ning and Rixin Lai and D. Huff and Fei Wang and K. D. T. Ngo and V. D. Immanuel and K. Karimi},
  journal={IEEE Transactions on Power Electronics},
  year={2009},
  volume={25},
  pages={16-23}
}
In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temperature operation. A thermal cycling test with large… CONTINUE READING