Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs

@article{Panth2017Shrunk2DAP,
  title={Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs},
  author={Shreepad Panth and Kambiz Samadi and Yang Du and Sung Kyu Lim},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
  year={2017},
  volume={36},
  pages={1716-1724}
}
Monolithic 3-D (M3D) integrated circuits (ICs) are an emerging technology that offer much higher integration densities than previous 3-D IC approaches. In this paper, we present a complete netlist-to-layout design flow to design an M3D block, as well as to integrate 2-D and 3-D blocks into an M3D SoC. This design flow is based on commercial tools built for 2-D ICs, and enhanced with our 3-D specific methodologies. We use the OpenSPARC T2 SoC as a case study, implement it in a 28-nm fully… CONTINUE READING

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