Shape and fatigue life prediction of chip resistor solder joints

@article{Zheng2009ShapeAF,
  title={Shape and fatigue life prediction of chip resistor solder joints},
  author={Guanqun Zheng and Chunqing Wang},
  journal={2009 International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2009},
  pages={1167-1170}
}
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of… CONTINUE READING