Self-aligned wafer-level integration technology with an embedded faraday cage for substrate crosstalk suppression

@inproceedings{Sharifi2014SelfalignedWI,
  title={Self-aligned wafer-level integration technology with an embedded faraday cage for substrate crosstalk suppression},
  author={Hasan Sharifi},
  year={2014}
}
A modification to a recently developed chip/wafer integration technology has proven to be very effective in suppressing the substrate crosstalk for mixed signal systems. In this implementation, analog and digital chips are fabricated on separate dies, and then integrated on a single Si substrate using a Self-Aligned Wafer-Level Integration Technology. A truly grounded faraday-cage structure is realized by sidewall metallization around each die resulting in an ultimate substrate noise reduction… CONTINUE READING