Security and Vulnerability Implications of 3D ICs

@article{Xie2016SecurityAV,
  title={Security and Vulnerability Implications of 3D ICs},
  author={Yang Xie and Chongxi Bao and Caleb Serafy and Tiantao Lu and Ankur Srivastava and Mark Mohammad Tehranipoor},
  journal={IEEE Transactions on Multi-Scale Computing Systems},
  year={2016},
  volume={2},
  pages={108-122}
}
Physical limit of transistor miniaturization has driven chip design into the third dimension. 3D integration technology emerges as a viable option to improve chip performance and increase device density in a direction orthogonal to costly device scaling. As 3D integration is becoming a promising technology for next-generation chip design, recent years have… CONTINUE READING

8 Figures & Tables

Topics

Statistics

01020201620172018
Citations per Year

Citation Velocity: 5

Averaging 5 citations per year over the last 3 years.

Learn more about how we calculate this metric in our FAQ.