Scheduling tests for 3D SoCs with temperature constraints

Abstract

In this paper the test scheduling of 3D SoC has been considered taking the thermal aspect into account. The 3D SoC consists of a complete system stacked vertically. Each stack or layer can have many functional blocks and any floorplan. Test scheduling of the stacked layers has been considered. We have built up a 3D stack for an assumed floorplan. The… (More)
DOI: 10.1109/EWDTS.2013.6673214

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