Scheduling Integrated Circuit Assembly Operations on Die Bonder

  title={Scheduling Integrated Circuit Assembly Operations on Die Bonder},
  author={W. L. Pearn and S. H. Chung and C. M. Lai},
  journal={IEEE Transactions on Electronics Packaging Manufacturing},
Solving the integrated circuit (IC) assembly scheduling problem (ICASP) is a very challenging task in the IC manufacturing industry. In the IC assembly factories, the jobs are assigned processing priorities and are clustered by their product types, which must be processed on groups of identical parallel machines. Furthermore, the job processing time depends on the product type, and the machine setup time is sequentially dependent on the orders of jobs processed. Therefore, the ICASP is more… CONTINUE READING