Scalable memory fabric for silicon interposer-based multi-core systems

Abstract

Three-dimensional (3D) integration is considered as a solution to overcome capacity, bandwidth, and performance limitations of memories. However, due to thermal challenges and cost issues, industry embraced 2.5D implementation for integrating die-stacked memories with large-scale designs, which is enabled by silicon interposer technology that integrates… (More)
DOI: 10.1109/ICCD.2016.7753258

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