STEAM: A fast compact thermal model for two-phase cooling of integrated circuits

@article{Sridhar2013STEAMAF,
  title={STEAM: A fast compact thermal model for two-phase cooling of integrated circuits},
  author={Arvind Sridhar and Yassir Madhour and David Atienza and Thomas Brunschwiler and John Richard Thome},
  journal={2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)},
  year={2013},
  pages={256-263}
}
Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation of a refrigerant flowing inside a heat sink. While possessing superior cooling properties, large-scale use of this technology in the industry is limited by the lack of thermal modeling tools that can accurately predict temperatures in a two… CONTINUE READING

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