SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

@article{Macchiolo2012SLIDICVVI,
  title={SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades},
  author={A. Macchiolo and L. Andricek and H. Moser and R. Nisius and R. Richter and P. Weigell},
  journal={Physics Procedia},
  year={2012},
  volume={37},
  pages={1009-1015}
}
  • A. Macchiolo, L. Andricek, +3 authors P. Weigell
  • Published 2012
  • Physics, Computer Science
  • Physics Procedia
    • Abstract We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration… CONTINUE READING
    View PDF on arXiv
    5 Citations
    Methods Citations
    1

    Figures and Tables from this paper

    Figures and Tables

    5 Citations
    Citation Type

    Citation Type

    Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors
    • 1
    • PDF
    SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
    • 1
    • PDF
    Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
    • PDF
    Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
    • 24
    • PDF
    Development of pixel detectors for particle physics using SLID-ICV interconnection technology
    • H. Moser, L. Andricek, +5 authors P. Weigell
    • Physics, Computer Science
    • 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
    • 2012

    References

    SHOWING 1-10 OF 11 REFERENCES
    Performance of thin pixel sensors irradiated up to a fluence of 1016neqcm−2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system
    • 15
    Development of thin pixel sensors and a novel interconnection technology for the SLHC
    • 22
    Development of a versatile and modular test system for ATLAS hybrid pixel detectors
    • 53
    Performance of n-in-p pixel detectors irradiated at fluences up to 5x10**15 neq/cm**2 for the future ATLAS upgrades
    • 5
    • PDF
    3D-integration of silicon devices: A key technology for sophisticated products
    • A. Klumpp, P. Ramm, R. Wieland
    • Materials Science, Computer Science
    • 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)
    • 2010
    • 16
    Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system
    • 20
    • PDF
    3D System Integration Technologies
    • E. Beyne
    • Computer Science
    • 2006 International Symposium on VLSI Technology, Systems, and Applications
    • 2006
    • 66
    Processing of ultra thin silicon sensors for future e/sup +/e/sup -/ linear collider experiments
    • 88
    Perfomance of thin pixel sensors irradiated up to 1016 neq/cm2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system
    • NIM A,
    • 2011
    Processing of ultra-thin silicon sensors for future e+e- linear collider experiments
    • IEEE Trans. Nucl. Sci
    • 2004