SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades
@article{Macchiolo2012SLIDICVVI, title={SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades}, author={Anna Macchiolo and Ladislav Andricek and H-G. Moser and Richard Nisius and Rainer Helmut Richter and Philipp Weigell}, journal={Physics Procedia}, year={2012}, volume={37}, pages={1009-1015} }
5 Citations
Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors
- Physics
- 2014
SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
- Physics
- 2013
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This…
Development of pixel detectors for particle physics using SLID-ICV interconnection technology
- Physics2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
- 2012
Using the SLID-ICV technology from Fraunhofer EMFT, thin pixel sensors with 50μm × 400μm pixel size are connected to the readout ASICs (ATLAS FE-I3) and complemented with vias.
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