SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

  title={SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades},
  author={A. Macchiolo and L. Andricek and H. Moser and R. Nisius and R. Richter and P. Weigell},
  journal={Physics Procedia},
  • A. Macchiolo, L. Andricek, +3 authors P. Weigell
  • Published 2012
  • Physics, Computer Science
  • Physics Procedia
  • Abstract We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration… CONTINUE READING
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