SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

@article{Macchiolo2012SLIDICVVI,
  title={SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades},
  author={A. Macchiolo and L. Andricek and H. Moser and R. Nisius and R. Richter and P. Weigell},
  journal={Physics Procedia},
  year={2012},
  volume={37},
  pages={1009-1015}
}
  • A. Macchiolo, L. Andricek, +3 authors P. Weigell
  • Published 2012
  • Physics, Computer Science
  • Physics Procedia
  • Abstract We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration… CONTINUE READING
    5 Citations

    Figures and Tables from this paper

    References

    SHOWING 1-10 OF 11 REFERENCES
    Development of a versatile and modular test system for ATLAS hybrid pixel detectors
    • 53
    3D-integration of silicon devices: A key technology for sophisticated products
    • A. Klumpp, P. Ramm, R. Wieland
    • Materials Science, Computer Science
    • 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)
    • 2010
    • 16
    3D System Integration Technologies
    • E. Beyne
    • Computer Science
    • 2006 International Symposium on VLSI Technology, Systems, and Applications
    • 2006
    • 66
    Processing of ultra thin silicon sensors for future e/sup +/e/sup -/ linear collider experiments
    • 88
    Perfomance of thin pixel sensors irradiated up to 1016 neq/cm2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system
    • NIM A,
    • 2011
    Processing of ultra-thin silicon sensors for future e+e- linear collider experiments
    • IEEE Trans. Nucl. Sci
    • 2004