SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades
@article{Macchiolo2012SLIDICVVI, title={SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades}, author={A. Macchiolo and L. Andricek and H. Moser and R. Nisius and R. Richter and P. Weigell}, journal={Physics Procedia}, year={2012}, volume={37}, pages={1009-1015} }
Abstract We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration… CONTINUE READING
Figures and Tables from this paper
5 Citations
Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors
- Physics
- 2014
- 1
- PDF
SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
- Materials Science
- 2013
- 1
- PDF
Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
- Physics
- 2013
- PDF
Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
- Physics
- 2013
- 24
- PDF
Development of pixel detectors for particle physics using SLID-ICV interconnection technology
- Physics, Computer Science
- 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
- 2012
References
SHOWING 1-10 OF 11 REFERENCES
Performance of n-in-p pixel detectors irradiated at fluences up to 5x10**15 neq/cm**2 for the future ATLAS upgrades
- Physics, Materials Science
- 2011
- 5
- PDF
3D-integration of silicon devices: A key technology for sophisticated products
- Materials Science, Computer Science
- 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)
- 2010
- 16
Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system
- Physics
- 2011
- 20
- PDF
3D System Integration Technologies
- Computer Science
- 2006 International Symposium on VLSI Technology, Systems, and Applications
- 2006
- 66
Processing of ultra thin silicon sensors for future e/sup +/e/sup -/ linear collider experiments
- Materials Science
- 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515)
- 2003
- 88
Perfomance of thin pixel sensors irradiated up to 1016 neq/cm2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system
- NIM A,
- 2011
Processing of ultra-thin silicon sensors for future e+e- linear collider experiments
- IEEE Trans. Nucl. Sci
- 2004