Router flip chip packaging solution and reliability

  title={Router flip chip packaging solution and reliability},
  author={E. Tosaya and Sylvain Ouimet and R. Martel and Richard T. Lord},
  journal={2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)},
  pages={1153-1160 Vol.1}
In January 2000, the requirements and functional specifications for a family of high availability core routers were defined and drove the development of six custom VLSI devices using large FCCGA (flip chip column grid array) packages with large devices. Such combinations have always been a challenge for first level packaging as well as second level reliability. For this specific application, a 58 mm ceramic carrier with device sizes up to 21 mm required qualification and to be brought into… CONTINUE READING


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