Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps


This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold &#x201C;bumps&#x201D;, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6&#x00D7;10<sup>&#x2212… (More)


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