Robust superconducting die attach process

@article{Yokoyama1997RobustSD,
  title={Robust superconducting die attach process},
  author={K. Yokoyama and G. Akerling and A. Smith and M. Wire},
  journal={IEEE Transactions on Applied Superconductivity},
  year={1997},
  volume={7},
  pages={2631-2634}
}
As complexity of superconducting digital systems increase, the need for multi-chip modules and a reliable, high bandwidth attachment scheme for superconducting die becomes more and more critical. We have developed a flip chip die attach process for Low Temperature Superconducting (LTS) chips using InSn reflow soldering. Using standard reflow techniques, we create highly reproducible, uniform 14 micron-high solder bumps on gold-defined pad regions. Subsequent alignment, compression, and reflow… CONTINUE READING

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