Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface

Abstract

Article history: Received 31 December 2015 Received in revised form 13 September 2016 Accepted 24 September 2016 Available online xxxx Through Silicon Via (TSV) technologywithmicro joint has been identified as the 3D package technology to overcome the limitations of I/O density and enhances the system performance compared to that of the conventional flip… (More)
DOI: 10.1016/j.microrel.2016.09.015

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