Reticle Enhancement Technology: Implications and Challenges for Physical Design

@inproceedings{Grobman2001ReticleET,
  title={Reticle Enhancement Technology: Implications and Challenges for Physical Design},
  author={Warren Grobman and M. Thompson and R. Wang and C. Yuan and Ruiqi Tian and E. Demircan},
  booktitle={DAC},
  year={2001}
}
In this paper, we review phase shift lithography, rule vs. model based methods for OPC and model-based tiling, and discuss their implications for layout and verificat ion. We will discuss novel approaches, using polarizing films on reticles, which change the game for phase-shift coloring, and could lead to a new direction in c:PSM constraints on physical design. We emphasize the need to do tiling that is model-driven and uses optimization techniques to achieve planarity for better manufacturing… CONTINUE READING
Highly Cited
This paper has 26 citations. REVIEW CITATIONS

Citations

Publications citing this paper.
Showing 1-10 of 18 extracted citations

Variability aware modeling of SoCs: From device variations to manufactured system yield

2009 10th International Symposium on Quality Electronic Design • 2009
View 5 Excerpts
Highly Influenced

An Effective Chemical Mechanical Polishing Fill Insertion Approach

ACM Trans. Design Autom. Electr. Syst. • 2016
View 1 Excerpt

Simple and Accurate Models for Capacitance Considering Floating Metal Fill Insertion

IEEE Transactions on Very Large Scale Integration (VLSI) Systems • 2009
View 1 Excerpt

Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability

2007 Asia and South Pacific Design Automation Conference • 2007
View 1 Excerpt

Simple and Accurate Models for Capacitance Increment due to Metal Fill Insertion

2007 Asia and South Pacific Design Automation Conference • 2007
View 1 Excerpt

Wire Sizing and Spacing for Lithographic Printability and Timing Optimization

IEEE Transactions on Very Large Scale Integration (VLSI) Systems • 2007

OPC-Aware Routing Reconstruction for OPE Reduction

2006 49th IEEE International Midwest Symposium on Circuits and Systems • 2006
View 1 Excerpt

Similar Papers

Loading similar papers…