Research on thermal aging and mechanical properties of the Nano-SiO<inf>2</inf>/epoxy adhesive

Abstract

Nano-inorganic/Epoxy composite is superior to pure Epoxy resin in the electrical and mechanical properties. In this paper, contents of 1wt% and 2wt% nano-Silica were added into Epoxy Tung-maleic Anhydride Adhesive Resin to study the electrical and mechanical properties of the composite. Firstly, the breakdown strength, flexural strength and impact strength of the composite are measured at room temperature. The experiment results indicate that with the increasing of nano-particle content, the breakdown strength of the composite increases, and 2wt% loading nano-Silica composite shows a better flexural and impact strength. Secondly, a thermal aging process which lasts for 168 hours, 336 hours, 504 hours and 672 hours respectively at 180&#x00B0;C is proceeded to the composite, and the breakdown strength after each thermal aging period is measured subsequently. The experiment results indicate that addition of nano-Silica improves the breakdown strength of adhesive resin before and the early period of thermal aging. However, the breakdown strength of 1% and 2% nano-Silica composite and adhesive resin trend to the same at the end of 28 days thermal aging. The research shows that the flexural and impact strength of Epoxy Tung-maleic Anhydride Adhesive Resin are effectively improved by the addition of nano-SiO<sub>2</sub> while the breakdown strength is improved slightly.

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Cite this paper

@article{Zhang2015ResearchOT, title={Research on thermal aging and mechanical properties of the Nano-SiO2/epoxy adhesive}, author={Peihong Zhang and S. Q. Cheng and Qi Shao}, journal={2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)}, year={2015}, pages={556-559} }