Research on nano-thermocompression bonding process using nanoporous copper as bonding layer

Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC… CONTINUE READING