Research and Development History of Three-Dimensional Integration Technology

@inproceedings{Kada2015ResearchAD,
  title={Research and Development History of Three-Dimensional Integration Technology},
  author={Morihiro Kada},
  year={2015}
}
The first chapter of the book introduces research and development history of three-dimensional (3D) integration technology. Concept of through-Si via (TSV) is old but the industrialization of 3D integration technology was leaded by 3D packaging technology first. 3D integration technology development using TSV have been conducted word wide since around 2000. This chapter describes the 3D technology development history from the beginning through 2012. 

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