Removed organic solderability preservative (OSPs) by Ar/O<inf>2</inf> microwave plasma to improve solder joint in thermal compression flip chip bonding


Organic soderability preservative (OSP) is the cheapest metal surface finish to apply for corrosion inhibition of bare copper. In conventional flip chip process, the various OSPs could be dissolved by rosin pre-fluxes before the chip placement to enable solder bonding. The thermal compression flip chip bonding with non-conductive paste (TCNCP) process is… (More)


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