Removal of SU-8 photoresist for thick film applications *

  title={Removal of SU-8 photoresist for thick film applications *},
  author={Paul M. Dentinger and W. Miles Clift and S. Goods},
SU-8 photoresist has consistently shown excellent resolution in thick film applications, has been utilized as an electroplating mold, and is sensitive to inexpensive UV sources. However, the highly crosslinked epoxy remaining after development is difficult to remove reliably from high aspect ratio structures without damage or alteration to the electroplated metal. A review of physical and chemical removal options is discussed with data on the most promising options shown. Several standard… CONTINUE READING
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