Removal of 10-nm contaminant particles from a wafer surface with supersonic CO2 particle beam


Contaminant control is becoming a major issue of nanoscale device. Cryogenic aerosol beam using micron-sized aerosol particles has long been successfully used to remove contaminant particles (CPs) down to 50nm, and supersonic particle beam using particles smaller than 100nm lowered the limit of cleaning down to 20nm size. In this study, the supersonic… (More)


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