Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading

Abstract

In this work we present the results on a reliability study on chip capacitor solder joints. The components were tested under three different loading conditions. First, temperature shock tests were conducted on a set of various chip capacitor components. Tested components were evaluated for the occurred damage and the causing damage mechanisms. Using finite… (More)

Topics

25 Figures and Tables

Slides referencing similar topics