Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging


Transient liquid phase (TLP) bonding is a promising advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances modern soldering techniques by raising the melting point to over 500 °C without detrimental high-lead materials. The bond also has greater reliability and rigidity due in part to a… (More)

8 Figures and Tables


  • Presentations referencing similar topics