Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging

Abstract

Transient liquid phase (TLP) bonding is a promising advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances modern soldering techniques by raising the melting point to over 500 °C without detrimental high-lead materials. The bond also has greater reliability and rigidity due in part to a… (More)

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