Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device

@article{Yamada2007ReliabilityOW,
  title={Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device},
  author={Yasushi Yamada and Yoshikazu Takaku and Yuji Yagi and I. Nakagawa and T. Atsumi and M. Shirai and I. Ohnuma and K. Ishida},
  journal={Microelectronics Reliability},
  year={2007},
  volume={47},
  pages={2147-2151}
}
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