Reliability of the aging lead free solder joint

  title={Reliability of the aging lead free solder joint},
  author={Hongtao Ma and J. C. Suhling and Pradeep Lall and M. J. Bozack},
  journal={56th Electronic Components and Technology Conference 2006},
  pages={16 pp.-}
Solder materials demonstrate evolving microstructure and mechanical behavior that changes significantly with environmental exposures such as isothermal aging and thermal cycling. These aging effects are greatly exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In the current study, mechanical measurements of thermal aging effects and material behavior evolution of lead free solders have been performed. Extreme care has… CONTINUE READING
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Publications referenced by this paper.
Showing 1-10 of 39 references

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy,

  • Q. Xiao, H. J. Bailey, W. D. Armstrong
  • Journal of Electronic Packaging,
  • 2004
Highly Influential
7 Excerpts

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength,

  • J.H.L. Pang, T. H. Low, B. S. Xiong, L. Xu, Neo, C C.
  • Thin Solid Films,
  • 2004
Highly Influential
4 Excerpts

Effect of Aluminum Addition on Tensile Properties of Naturally Aged Sn-9Zn Eutectic Solder,

  • C. M. Chuang, T. S. Liu, L. H. Chen
  • Journal of Materials Science,
  • 2002
Highly Influential
5 Excerpts

Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys,

  • Y. Miyazawa, T Ariga
  • Materials Transactions of the Japan Institute of…
  • 2001
Highly Influential
4 Excerpts

Microstructural Change and Hardness of Lead Free Solder Alloys,

  • Y. Miyazawa, T. Ariga
  • Proceedings of the First International Symposium…
  • 1999
Highly Influential
4 Excerpts

Mechanical Characterization of Sn-3.5Ag

  • H. Rhee, K. N. Subramanian, A. Lee, J. G. Lee
  • Solder Joints
  • 2006
1 Excerpt

A Strain Rate Ratio Approach for Assessing CreepFatigue Life of 63Sn-37Pb Solder Under Shear Loading

  • Y. Tsukada, H. Nishimura, H. Yamamoto, M. Sakane
  • Journal of Electronic Packaging,
  • 2005
1 Excerpt

Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis,

  • Q. Zhang, A. Dasgupta, D. Nelson, H. Pallavicini
  • Journal of Electronic Packaging,
  • 2005
1 Excerpt

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