Reliability of the aging lead free solder joint

@article{Ma2006ReliabilityOT,
  title={Reliability of the aging lead free solder joint},
  author={Hongtao Ma and J. C. Suhling and Pradeep Lall and M. J. Bozack},
  journal={56th Electronic Components and Technology Conference 2006},
  year={2006},
  pages={16 pp.-}
}
Solder materials demonstrate evolving microstructure and mechanical behavior that changes significantly with environmental exposures such as isothermal aging and thermal cycling. These aging effects are greatly exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In the current study, mechanical measurements of thermal aging effects and material behavior evolution of lead free solders have been performed. Extreme care has… CONTINUE READING
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