Reliability of Strain-Si FPGA Product Fabricated by Novel Ultimate Spacer Process


Strain-Si field-programmable gate arrays (FPGA) is fabricated by using ultimate spacer process (USP) with a single capping stress liner. An overall 15% speed enhancement without compromising yield was obtained. The product reliability assessment, including HTOL, TCT, ESD (CDM and HBM) and latch-up, was performed simultaneously on USP and control parts. They… (More)


14 Figures and Tables