Reliability of Strain-Si FPGA Product Fabricated by Novel Ultimate Spacer Process

Abstract

Strain-Si field-programmable gate arrays (FPGA) is fabricated by using ultimate spacer process (USP) with a single capping stress liner. An overall 15% speed enhancement without compromising yield was obtained. The product reliability assessment, including HTOL, TCT, ESD (CDM and HBM) and latch-up, was performed simultaneously on USP and control parts. They… (More)

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Cite this paper

@article{Luo2006ReliabilityOS, title={Reliability of Strain-Si FPGA Product Fabricated by Novel Ultimate Spacer Process}, author={Y. Luo and D. Nayak and Joonhyun Lee and Daniel Gitlin and C. Tha - as Tsai}, journal={2006 IEEE International Integrated Reliability Workshop Final Report}, year={2006}, pages={175-178} }