Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Abstract

0026-2714/$ see front matter 2013 Elsevier Ltd. All rights reserved. http://dx.doi.org/10.1016/j.microrel.2013.08.021 ⇑ Corresponding author. Tel.: +358 294 487 962; fax: +358 8 553 2728. E-mail addresses: jussi.putaala@ee.oulu.fi (J. Putaala), jari.hannu@ee.oulu.fi (J. Hannu), esa.kunnari@tamk.fi (E. Kunnari), matti.mantysalo@tut.fi (M. Mäntysalo), olli… (More)
DOI: 10.1016/j.microrel.2013.08.021

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