Reliability of Cu nanoparticle joint for high temperature power electronics

@article{Ishizaki2014ReliabilityOC,
  title={Reliability of Cu nanoparticle joint for high temperature power electronics},
  author={Takayuki Ishizaki and A. Kuno and A. Tane and M. Yanase and F. Osawa and Toshiyuki Satoh and Y. Yamada},
  journal={Microelectronics Reliability},
  year={2014},
  volume={54},
  pages={1867-1871}
}
Abstract Power cycle reliability of Cu nanoparticle joint has been studied for high temperature operation of power devices. Al 2 O 3 heater chips and Cu–65 wt% Mo baseplates were joined by Cu nanoparticles and Sn–0.7Cu and power cycle tests of 65/200 °C and 65/250 °C were carried out on the joints. The Cu nanoparticles were prepared by reducing Cu carbonate in ethylene glycol with dodecanoic acid + dodecyl amine (C12) and decanoic acid and decyl amine (C10) as capping agents. A power cycle test… CONTINUE READING

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