Reliability assessment of lead- free solder joint, based on high cycle fatigue & creep studies on bulk specimen

@inproceedings{Thambi2018ReliabilityAO,
  title={Reliability assessment of lead- free solder joint, based on high cycle fatigue & creep studies on bulk specimen},
  author={J. Thambi},
  year={2018}
}
ENGLISH) .......................................................................................................... II ABSTRACT (DEUTSCH) ....................................................................................................... IIIDEUTSCH) ....................................................................................................... III TABLE OF CONTENTS ......................................................................................................... IV 

References

Publications referenced by this paper.
SHOWING 1-10 OF 168 REFERENCES

Tin and its alloys

VIEW 11 EXCERPTS
HIGHLY INFLUENTIAL

Y

Y. Chen
  • Jin and R. Kang, “Coupling damage and reliability modeling for creep and fatigue of solder joints,” Microelectronics Reliability, vol. 75, pp. 233-238
  • 2017
VIEW 17 EXCERPTS
HIGHLY INFLUENTIAL

Fundamentals Of Creep In Metals And Alloys

VIEW 10 EXCERPTS
HIGHLY INFLUENTIAL

J

H. W. Zhang, Y. Liu
  • Wang and F. L. Sun, “Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading,” Microelectronics reliability
  • 2015
VIEW 6 EXCERPTS
HIGHLY INFLUENTIAL

Fatigue and corrosion in metals

VIEW 15 EXCERPTS
HIGHLY INFLUENTIAL

L

L. Zhang, S. B. Xue
  • L. Gao and Y. Chen, “Creep behavior of SnAgCu solder with rare earth Ce doping,” Transaction of nonferrous metals, vol. 18, no. 6, pp. 753-778
  • 2009
VIEW 5 EXCERPTS
HIGHLY INFLUENTIAL

M

R. Metasch, R. C. Boreto
  • Roellig and S. Wiese, “Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens,” in EuroSim
  • 2009
VIEW 21 EXCERPTS
HIGHLY INFLUENTIAL

Verformungs und Schädigungsverhalten metallischer Werkstoffe in Mikrodimensionen

S. Weise
  • Dresden
  • 2008
VIEW 10 EXCERPTS
HIGHLY INFLUENTIAL