Reliability assessment of a MEMS microphone under shock impact loading

@article{Li2013ReliabilityAO,
  title={Reliability assessment of a MEMS microphone under shock impact loading},
  author={Jin Li and Joonas Makkonen and Mikael Broas and Jussi Hokka and Toni T. Mattila and Mervi Paulasto-Krockel and Jingshi Meng and Abhijit Dasgupta},
  journal={2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)},
  year={2013},
  pages={1-6}
}
In this paper the shock impact reliability of a MEMS microphone is studied through experiments and finite element simulations. The maximum acceleration tolerance of the device is studied and the effect of shock impact orientation is also investigated. Finite element method is employed to determine the potential failure locations of the MEMS structure. Several challenges of the modeling process, such as the large differences in dimension, the complexity of the structures, and the material… CONTINUE READING

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