Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps

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@article{Sukharev2001ReliabilitySO, title={Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps}, author={Valeriy Sukharev and Ben P. Shieh and Ratan K. Choudhury and Chong W. Park and Krishna C. Saraswat}, journal={Microelectronics Reliability}, year={2001}, volume={41}, pages={1631-1635} }