Reliability Optimization of Stacked System-in-Package Using FEA

@article{Valtanen2006ReliabilityOO,
  title={Reliability Optimization of Stacked System-in-Package Using FEA},
  author={Jukka Valtanen and Pekka Heino},
  journal={EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems},
  year={2006},
  pages={1-5}
}
In this work, thermo-mechanical reliability of solder joints of stacked thinned bare dice system-in-package is studied with the finite element method using three-dimensional models. The studied package consists of one to five layers. In every layer two 5 mm times 5 mm silicon chips have been joined with flip chip method onto an 8 mm times 14 mm aramid-epoxy… CONTINUE READING