Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging

@inproceedings{Swaminathan2001ReliabilityAO,
  title={Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging},
  author={Rajesh Swaminathan and Harish Bhaskaran and Peter Sandborn and Gowrishankar Subramanian and Michael Andrew Deeds and Kevin R. Cochran},
  year={2001}
}
The bond layer is often the weakest link in the reliability of chip packages in the IC industry. MEMS packages are no exception to this trend. This paper presents a non-destructive methodology for determining delamination in a chip-to-chip bonded MEMS. Experimental methods are used to determine the bond strength in samples subjected to environmental testing… CONTINUE READING