Relative and absolute warpage modeling on molded packages

@article{Zheng2015RelativeAA,
  title={Relative and absolute warpage modeling on molded packages},
  author={Jiantao Zheng and Eric Zhou and Lejun Wang and Manuel Aldrete and Rajneesh Kumar and Ahmer Syed},
  journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
  year={2015},
  pages={1538-1545}
}
Package warpage is an important consideration for mobile device applications. With thinner packages and PoP applications, it is critical that both room temperature and high temperature warpage of the package are measured. Design optimization and material selection also requires simulations to predict warpage, which requires model calibration. Historically, warpage model calibration has been an issue in the industry for many reasons: measurement accuracy, package assembly process, material… CONTINUE READING