Reject frame discrimination system by a z-level and method of a wire bonding using the same

@inproceedings{2004RejectFD,
  title={Reject frame discrimination system by a z-level and method of a wire bonding using the same},
  author={김대수 and 김동빈 and 김병수 and 오국진 and 이상우 and 정석천},
  year={2004}
}
The wire-bonding and die-attach device and a method of using a reject frame determination system according to the level of the jet is started. Using a reject frame determination system of the jet-level wire bonding and die-attach device is a frame from the jet axis, and control the jet-axis movement, and the reference position capable of up-down movement to the top of the frames from the reference position on the frames of the printed circuit board be provided by the host controller to… CONTINUE READING

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