Reflow profile simulation by finite element method for a BGA package

  title={Reflow profile simulation by finite element method for a BGA package},
  author={Shen Liang and Wang Mingxiang and He Yonghong and Lam Tim Fai and Jiang Yu Qi},
  journal={2005 6th International Conference on Electronic Packaging Technology},
During reflow process, solder ball temperature profile is a concern, but it is difficult to direct measure the temperature. In this study, a forced convective airflow reflow furnace was analyzed. Measured profiles from two typical BGA packages were simulated successfully. Temperature profile of package surface has been compared with that of solder balls. Temperature distribution among solder ball array has been observed and analyzed. It has been found that impinging jet airflow model provides… CONTINUE READING


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