Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package


This paper deals with the thermal design of an electronics package and a demonstration of reduced thermal resistance for high-power amplifiers (HPAs). The focus is package internal thermal management. A carbon fiber-reinforced carbon composite- (C/C composite) based heat sink is proposed as a means of enhancement over the more conventional CuMo material… (More)


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