Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package

Abstract

This paper deals with the thermal design of an electronics package and a demonstration of reduced thermal resistance for high-power amplifiers (HPAs). The focus is package internal thermal management. A carbon fiber-reinforced carbon composite- (C/C composite) based heat sink is proposed as a means of enhancement over the more conventional CuMo material… (More)

Topics

11 Figures and Tables