Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

  title={Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials},
  author={Pinki Kumari and Kuldeep Singh and Anuj Kumar Singal},
Today, Hygroscopic swelling is one of the biggest challenging problem of Epoxy mold compound (EMC) in packaging with Microelectromechanical system (MEMS) devices. To overcome this hygroscopic swelling problem of EMC and guard the devices, MEMS devices are molded in this paper with different Mold Compound (MC) i.e. titanium and ceramic etc. during their interconnection with the board. Also, a comparatively performance analysis of this various mold compound with MEMS pressure sensor has been… Expand

Figures and Tables from this paper


Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound
The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependentExpand
Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging
This paper presents a continuation of the previous hygroscopic characterization work on epoxy molding compounds, which aims to accurately measure the diffusivity and coefficient of hygroswellingExpand
Effect of moisture swelling on MEMS packaging and integrated sensors
A design optimization of a pressure sensor packaging towards minimization of sensor drift due to stresses induced by moisture uptake and an optimized package design was achieved. Expand
Characterization of hygroscopic swelling behavior of mold compounds and plastic packages
Hygroscopic swelling behavior of mold compounds is analyzed by a novel experimental procedure using a whole-field displacement technique. Large variation in moisture content at the virtualExpand
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
  • I. Khalilullah, T. Reza, +7 authors Xuejun Fan
  • Materials Science, Computer Science
  • 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  • 2017
A new generation of silicone/phosphor composite films and a commonly-used EMC material for COB LEDs are studied regarding their moisture absorption and hygroscopic swelling behaviors by in-situ measurements. Expand
Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy
One type of polymer EPN1180 is selected for the hygroscopic swelling tests and the sample is made in the thickness of 30mum . Coefficient of thermal expansion is tested by using DMA Q800 andExpand
Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging
Moisture induced swelling and sorption characteristics of four types of epoxy molding compounds used in the packaging of semiconductor devices were experimentally investigated. The hygroscopic strainExpand
Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
An advanced method based on the digital image correlation technique is implemented for characterization of hygroscopic swelling of thin film polymers. The accuracy of the proposed method isExpand
Packaging Effect on MEMS Pressure Sensor Performance
  • R. Krondorfer, Y. Kim
  • Materials Science
  • IEEE Transactions on Components and Packaging Technologies
  • 2007
In this study, the effect of epoxy based molding compound packaging on a micro-electro-mechanical system (MEMS) pressure sensor performance is investigated. A series of experiments were conducted toExpand
Static and dynamic operation of metal-coated hydrogel cantilever humidity sensors based on hygroscopic mismatch
Hydrogels, intrinsically sensitive materials to water molecules (i.e. moisture), have been mostly employed as a humidity sensing layer on top of elastic mechanical structures such as microcantileversExpand