Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

@inproceedings{Kumari2020ReducingTH,
  title={Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials},
  author={Pinki Kumari and Kuldeep Singh and Anuj Kumar Singal},
  year={2020}
}
Today, Hygroscopic swelling is one of the biggest challenging problem of Epoxy mold compound (EMC) in packaging with Microelectromechanical system (MEMS) devices. To overcome this hygroscopic swelling problem of EMC and guard the devices, MEMS devices are molded in this paper with different Mold Compound (MC) i.e. titanium and ceramic etc. during their interconnection with the board. Also, a comparatively performance analysis of this various mold compound with MEMS pressure sensor has been… Expand

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