Reducing Simultaneous Switching Noise and EMI on Ground / Power Planes by Dissipative Edge Termination

  title={Reducing Simultaneous Switching Noise and EMI on Ground / Power Planes by Dissipative Edge Termination},
  author={istvan. novak},
Power and ground planes should exhibit low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances which increase the impedance and also the radiation from the edge of the board. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, as well as measured impedance and radiation plots are presented for a pair… CONTINUE READING
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Publications referenced by this paper.
Showing 1-7 of 7 references

Radiation from packaged Integrated circuits

R. Koga
Proceedings of the 1994 EMC Symposium, May 16-20, 1994, Sendai, Japan, pp. 581-584. • 1994

SPRINT and SIGHTS Simulation of Power and Ground Distribution Planes

16 HDTApplicationNote
High Design Technology, Italy, 1993. 0.00E+00 2.00E-01 4.00E-01 6.00E-01 8.00E-01 1.00E+00 1.20E+00 Magnitude [ohm] 0.00E+00 5.00E-02 1.00E-01 1.50E-01 2.00E-01 2.50E-01 3.00E-01 3.50E-01 Magnitude [ohm] Impedance Self, Magn 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+06 1.00E+07 1.00E+08 1.00E+09 • 1993
View 3 Excerpts

Microstrip antenna technology at ball aerospace systems, Boulder, Colorado

IEEE Antennas and Propagation Society Newsletter • 1979
View 1 Excerpt

Effects of losses in power planes in the simulation of simultaneous switching noise

J. Fang, D. Xue, Y. Chen
Proceedings of the 3 Topical Meeting on electrical Performance of Electronic Packaging, pp. 110-112
View 1 Excerpt

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