Reduced order thermal modeling of power electronics modules via Time Domain Vector Fitting

@article{DArco2013ReducedOT,
  title={Reduced order thermal modeling of power electronics modules via Time Domain Vector Fitting},
  author={Salvatore D’Arco and Bjorn Gustavsen},
  journal={2013 17th IEEE Workshop on Signal and Power Integrity},
  year={2013},
  pages={1-4}
}
Thermal modeling of power electronics modules is often used for the prediction of internal temperatures which is essential for safe operation and life time estimations. However, the models provided by manufacturers are normally quite simplified, accounting only partially for the crosscoupling effects between chips. A more accurate analysis is possible using Finite Element Method (FEM) analysis but its combination with general time domain simulations is complicated and computationally demanding… CONTINUE READING

Citations

Publications citing this paper.

References

Publications referenced by this paper.
SHOWING 1-7 OF 7 REFERENCES

Package macromodeling via time-domain vector fitting

VIEW 6 EXCERPTS
HIGHLY INFLUENTIAL

Influence of thermal cross-couplings on power cycling lifetime of IGBT power modules

VIEW 2 EXCERPTS

" Real - Time Compact Thermal Models for Health Management of Power Electronics " , IEEE Trans

  • T. Poller, S. D'Arco, +3 authors C. M. Johnson